Sonia Leon

Senior Principal Engineer, 3D-IC STCO Design Technology Pathfinding at Intel Corporation | San Francisco Bay Area

About Sonia Leon

Sonia Leon serves as a Senior Principal Engineer at Intel Corporation, where she plays a pivotal role in 3D-IC STCO (System Technology Co-Optimization) Design Technology Pathfinding. With over 30 years of experience in the semiconductor industry, Sonia has a proven track record of delivering innovative products and intellectual property across diverse sectors, including mobile, servers, multimedia, and digital signal processing (DSP). Her expertise lies in bridging the gap between system architecture, design, technology for manufacturing (TFM), and silicon, ensuring that every phase of the product development cycle—from concept to revenue—is meticulously executed.

In her current role, Sonia is at the forefront of advanced design technology, focusing on the integration of 3D-IC architectures that enhance performance while optimizing power management. She is instrumental in leveraging her deep knowledge of EDA tools and methodologies to drive the development of cutting-edge application-specific integrated circuits (ASICs) and system-on-chip (SoC) solutions. Her work with TSMC's 28nm process technology exemplifies her commitment to pushing the boundaries of semiconductor design, enabling Intel to maintain its competitive edge in a rapidly evolving market.

Sonia's unique combination of technical expertise and business acumen allows her to navigate complex challenges, ensuring that strategic objectives align with execution capabilities. Her leadership in key projects not only fosters innovation but also cultivates collaboration across multidisciplinary teams, ultimately contributing to Intel's mission of delivering high-performance computing solutions. As she continues to explore new frontiers in 3D-IC technology, Sonia remains a vital asset to Intel, driving advancements that will shape the future of the semiconductor landscape.

Sonia Leon Work

Senior Principal Engineer, 3D-IC STCO Design Technology Pathfinding at Intel Corporation in April 2020 to Present

Senior Principal Engineer, Advanced Product Design Chief Architect. Programmable Technologies. at Intel Corporation in July 2019 to March 2020

Sr. Principal Engineer/Sr. Director, Advanced Product Design Chief Architect. Modem Technology Group at Intel Corporation in October 2017 to August 2019